FREMONT, Calif. -- Elma Electronic Inc., a global manufacturer of electronic packaging products, has announced new ruggedized MicroTCA enclosures in a 19” rackmount format.

The new MicroTCA chassis features modified front panels that can be secured to the chassis. This provides more protection for shock and vibration. Shock absorbers/dampers can also be added to the enclosure for extra protection. Thermal management can be achieved via either convection or conduction-cooling.

As with Elma’s recently released ATR (Air Transport Rack) version of Ruggedized MicroTCA chassis, the 19” rackmount enclosures are designed to meet MIL-STD-810F, 167, 461D, and 901D. Standard ruggedization techniques can be utilized, including a shock isolated card cage and device mounting. Rugged chassis shells are incorporated using thick aluminum sheets, extrusions, and die-castings.

The MicroTCA backplane used has 6 AMC, 1 MCH, 1 PM (to 600W) slots. Optimized via signal integrity studies, the backplane supports PCI-Express, Serial Rapid I/O and 10GBase-BX4 Switching. It has direct SATA / SAS connections and 3 synchronization clock networks. Other configurations are available.

Other chassis features include front-to-rear evacuative cooling, line filter, GND stud, shielded relay, IO panel, USB port, and fuse holder. The removable fan tray has 1x (120mm x 120mm) fan and 2x (40mm x 40mm) fans, and a finger guard.

Elma Electronic Inc.