Comms chips

Zarlink Adds R&D Funds

OTTAWA -- Zarlink Semiconductor (NYSE/TSX:ZL) today announced that it will be receiving a research and development investment of up to CND$7.1 million over a three-year period through TPC (Technology Partnerships Canada), an agency of Industry Canada, to develop innovative semiconductor technologies that will allow service providers to migrate to a converged network architecture delivering the complete range of voice, data and multimedia services. Through this TPC investment, Zarlink is developing semiconductor technologies that will support a smooth network migration and allow network operators to deliver new applications to their customers while still protecting their investment in legacy communications equipment.

Global voice and data networks are rapidly evolving from a traditional circuit-based to a new packet-switched architecture based on IP (Internet Protocol) transmission technology. The widespread adoption of IP as an underlying, common technology is allowing network operators to significantly lower their operating costs, while supporting a new range of revenue-generating voice, video and data services alongside call center, security, multimedia and conferencing applications.

Zarlink Semiconductor Inc. (NYSE/Toronto: ZL)

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