Bookham Boosts Integration
NORTHAMPTONSHIRE, U.K. -- Bookham Technology plc (LSE: BHM, NASDAQ: BKHM) will present at the Semiconductor 2003 Conference its radical technology approach to meeting the pressing needs of the optical communications industry to cut costs while increasing functionality. Arguing that a key requirement of optoelectronic component suppliers is now the delivery of solution-level products — rather than discrete optical components — to equipment manufacturers, Bookham has selected three semiconductor processes that allow smarter integration by driving down costs while simultaneously enhancing system functionality.
Bookham’s paper shows how scalable high-yield multiwafer processes based on InP, GaAs and silicon individually allow the monolithic integration of multiple functions, while hybrid integration of the processes together leads to optical solutions in single modules at significant cost savings over conventional approaches using discrete components.
“This approach is primarily aimed at reducing cost for the equipment manufacturer both in engineering and assembly,” says Andrew Carter, Bookham Technology VP of Research and the paper’s author. “Vendors of metro and long-haul optical systems are under terrific pressure from the current slashing of capex budgets by their carrier customers, and the only way out for them is to cut their own costs as well. Bookham has now shown that smart optoelectronic solution integration will help them achieve this goal.”
Bookham Technology plc