XPAK Group Unveils Specs

BOULDER, Colo. -- Charter members of the XPAK Multi-source Agreement (MSA) group today announced that specifications for the XPAK 10 Gigabit Ethernet optical module form factor are now available on the group’s website: http://www.xpak.org. The group also announced that Molex Incorporated (NASDAQ: MOLX) and Tyco Electronics have joined the MSA membership with McData Corp., QLogic Corp. and Spirent Communications adding support as new sponsors. The newly published XPAK specifications define mechanical, thermal and electromagnetic interference (EMI) mitigation features of the form factor, as well as reference 10 Gigabit Ethernet optical and XENPAK MSA electrical specifications. Offering new levels of density, power efficiency and ease of integration to networking equipment, the XPAK module enables equipment manufacturers to implement 10 Gigabit Ethernet links up to 10- and eventually 40-kilometers. This increased distance enables 10-Gigabit Ethernet to move from today’s aggregated uplink applications to high-volume, server-to-switch and storage-to-switch links. “XPAK’s strength lies in its similarities to XENPAK as a classic second-generation, follow-on product,” noted Karen Liu, director of optoelectronic modules at RHK in a recent report, adding that adoption of XPAK is straightforward because the interface is identical to the pinout of the XENPAK 70-pin XAUI (10Gbps Attachment Unit Interface).XPAK Multi-Source Agreement Group