XPAK Enhances 10-Gig Spec

SAN JOSE, Calif. -- The XPAK Multi-Source Agreement (MSA) group today announced that Revision 2.0, the "build-to" specification, of the XPAK 10-Gigabit Ethernet optical module form factor is now available on the group's Web site: http://www.xpak.org. The group also announced enhancements to the original XPAK specification, and said that its membership has grown to 21 companies, which demonstrates growing acceptance of and support for the XPAK specification throughout the enterprise, storage area network (SAN) and switching center market segments. The XPAK specification, initially announced by Infineon, Intel and Picolight, uses the electrical interface and register set defined by the XENPAK MSA. It defines mechanical, thermal and electromagnetic interference (EMI) mitigation features for a reduced-size, pluggable 10-Gigabit Ethernet module that is PCI-compliant in height, width and bezel opening. Revision 2.0, the build-to specification, contains a number of enhancements that were developed in response to input from users and MSA members, and allows designers to lay out their small-form-factor boards with confidence that they will be in full compliance with the specification. XPAK Multi-Source Agreement Group