VI Systems Awarded 3 U.S. Patents

BERLIN -- VI Systems GmbH announces today that the first of the three allowed patents, entitled “Opto-electronic assembly for high speed transmission” is essential to protect VIS’ proprietary concept of optoelectronic assembly for high speed signal transmission based on surface-emitting/receiving components allowing electrical (–3dB) bandwidth in the TO-can package to be increased to 90GHz. The concept is suitable for single channel links and also extended to multichannel data transmission. This IP is, for example, applied to VIS’ 850 nm multimode fiber receiver subassemblies operating at 50Gb/s, whereas these subassemblies are using VIS PIN photodetectors and transimpedance amplifiers. It is expected that in mass production such a microassembly will not cost more than only a few dollars.The second patent, entitled “Optoelectronic interconnect for high frequency data transmission at low power consumption” describes the requirements allowing optical links each suitable for transmission of optical signals at speeds at and above 20 Gigabit per second at power consumption below 10 milliWatt per Gigabit per second. The interconnect includes also optical transmitters and detectors having capacitances below 150 femto-Farads.The third patent, entitled “Method for encoding and decoding of optical signals” addresses a robust multilevel coding scheme, where the transmitter is fast, and the receiver is slow such that the response time of the receiver exceeds at least the shortest of the durations of the optical pulses.VIS offers engineering samples of their fiber coupled 50 Gbit/s photodetector module for 850nm wavelength (part no. R50-850). The company has started shipping testboard sets of its fiber coupled 4 x 25 Gbit/s parallel optical transmitter (VHXT5204A-840) and receiver (VHXR5204A-840). VI Systems GmbH