Teradyne Is Telcordia Compliant

NASHUA, N.H. -- Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), a leading manufacturer of high-speed/high-density interconnects, multi-gigabit custom backplanes, and high-performance systems integration and test, today announced its NexLev? parallel board-to-board connector has met requirements of Telcordia GR-1217-CORE qualification. Telcordia requirements are recognized industry wide as an indicator of connector reliability and are used across a wide range of products, including equipment for networks, data processing, and computer storage. As a parallel interconnect system, Teradyne's NexLev was tested for compliance with Telcordia's controlled environment requirements. To achieve this specific qualification, NexLev passed four test sequences which cover a range of inputs, such as vibration, physical shock, thermal aging, heat and humidity, sand and dust, and mixed flowing gas. These inputs mimic the typical worst case environments that the connector is expected to encounter over its life. The four tests simulate, over a relatively short period of time, what will happen over 10 to 20 years of actual field use. "Telcordia compliance assures our customers that our connectors will perform to satisfaction over the expected life of their products," said Dan Murphy, VP of Sales and Application Engineering at TCS. "Meeting this reliability standard reinforces the high-performance capabilities of NexLev that make it a top choice among designers of telecom and datacom equipment." Teradyne Inc.