Featured Story
After losing Nokia, crisis-hit Intel seeks network assets buyer
Nokia is substituting Arm-based chips for Intel silicon in its latest 5G products amid talk of a possible Ericsson takeover of Intel assets.
New space-saving platform suitable for mobile handsets, data cards/dongles and other embedded solutions
February 15, 2011
BARCELONA -- Intel Mobile Communications, a leading vendor of advanced mobile semiconductors solutions for handheld devices, today announced the compact multimode (LTE/3G/2G) platform XMM 7060.
The latest enhancement of the company`s comprehensive slim modem portfolio consists of the highly integrated multimode baseband processor X-GOLDTM 706 and the associated multimode RF transceiver SMARTiTM 4G. The chipset is complemented by a robust, full-featured and comprehensively validated 3GPP Release 8 triple mode protocol stack with Inter-Rat features. The new space saving platform is suitable for integration in LTE-enabled portable devices such as mobile handsets, data cards/dongles and other embedded solutions.
LTE is a fast growing market driven by the increasing demand for such mobile broadband services as multimedia broadcasting, music and video streaming and high-speed mobile Internet. It is expected to become the worldwide mobile standard for high-speed Internet due to its high data throughput and high spectral efficiency. However, LTE is faced with the challenge of a strongly fragmented regional frequency landscape. This calls for major RF innovation to create a low-power modem platform that can cover all the diverse frequency plans fitting to portable devices. Intel Mobile Communications is leveraging its proven leadership in RF and meets this challenge by offering the XMM 7060 platform.
Intel Corp. (Nasdaq: INTC)
You May Also Like