GOLETA, Calif. -- Aurrion, Inc., a world leader in silicon photonics and pioneer in photonic heterogeneous integration, will present a recent breakthrough demonstration of lasers, for both telecom and datacom applications, monolithically integrated with silicon photonic circuits on March 21, 2013 as part of the post deadline session at the Optical Fiber Communications (OFC) Conference in Anaheim, California. Although silicon photonics has long promised to simultaneously bring orders of magnitude improvements in complexity and cost to the fabrication of optical circuits for telecom and datacom markets, the absence of high performance light sources has slowed its adoption.
Aurrion, however, has demonstrated two essential laser technologies to address this silicon photonic technology gap: 1) narrow-linewidth, widely-tunable 1550nm lasers for 100Gbps long-haul and metro telecom links, and 2) uncooled 1310nm WDM laser arrays for 100Gbps and 400Gbps datacenter and high performance computing (HPC) interconnects. Both laser technologies were fabricated simultaneously on the same silicon wafer using established commercial foundry infrastructure and the heterogeneous integration platform developed by Aurrion. “Aurrion’s heterogeneously integrated silicon photonics platform enables a whole new class of capability by integrating lasers with silicon photonics and intimately combining best-in-class electronics through co-packaging,” said Dr. Gregory Fish, Aurrion’s CTO.