Etec Offers MEMS Testers

PEABODY, Mass. -- Etec, Inc. announced today the introduction of the DynamiX product line of Optical MEMS wafer/die test systems. DynamiX provides semi-automated testing of MEMS and MOEMS, offering an integrated solution optimized for medium-volume and pilot production of MOEMS devices. Users can test and characterize a wide range of MOEMS devices, including variable optical attenuators (VOAs), optical switches, optical cross connects (OXCs), and 2-D and 3-D micro-mirror arrays. The system provides optical, electrical, and mechanical testing in an integrated system. Typical measurements performed with the system include: characterization of the displacement of the MEMS element as a function of applied stimulus (voltage/current), in-plane and out-of-plane displacement measurements in 6 degrees-of-freedom with nanometer resolution, response time, resonance, and surface characterization measurements such as profilometry. DynamiX incorporates a semi-automated analytical wafer prober, a state-of-the-art optical head assembly (incorporating a new version of Etec’s model MMA MEMS Motion Analyzer), and a precision electrical stimulus/measurement package. Etec’s M/STeP open architecture software environment enables easy operation for either R&D device characterization or semi-automated production. Etec’s DynamiX enables MEMS device manufacturers to rapidly and cost-effectively deploy test solutions that can take MEMS devices from the R&D lab to the production floor. The system reduces time to market and cost of test, in a robust, low cost of ownership tool.Etec Inc.