ADC Selects Metalink Chipset

ADC selects Metalink broadband access chipsets to lower costs for HDSLx platforms

February 18, 2003

1 Min Read

MINNEAPOLIS -- ADC (NASDAQ: ADCT; announced today it will use chipsets developed by Metalink (NASDAQ: MTLK; in its Soneplex/HiGain HDSL2 and HDSL4 products. The chipset provides significantly lower power consumption and improved thermal performance, helping telecommunications service providers efficiently and cost effectively deploy high-speed data services throughout North America. HDSLx technology uses copper infrastructure to deliver T1 services, primarily to small- and medium-sized businesses. Currently all five Regional Bell Operating Companies (RBOC) have ADC HDSLx offerings deployed in their networks. Several of these service providers are now evaluating ADC's products using the new Metalink chipset. With the new chipset, carriers can obtain a feature-rich and highly reliable HDSLx solution for their networks."We selected Metalink for its innovative leadership and expertise in DSL technologies," said Mike Pratt, president of the Wireline Systems Business Unit at ADC. "After evaluating several options, including in-house development, we determined that Metalink would give us the most technically innovative solution, with significant product feature and cost advantages. Working with Metalink, ADC can tap a level of experience and best-of-class capabilities that go beyond HDSLx. Metalink's demonstrated professionalism and customer support has been outstanding as well." "Metalink has developed technology and products for telecommunications and networking equipment makers for more than a decade," said Tzvika Shukhman, CEO at Metalink. "We have deployed more than six million chipsets in various products, so our expertise and capabilities in making first-in-world, high quality products is proven. We are eager to help ADC enhance existing networks and ultimately help service providers deliver highly reliable and efficient services." Metalink Ltd. ADC Telecommunications Inc.

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