Mindspeed announces industry's first DS3/E3/STS-1 'line card on a chip' family for datacom and telecom applications

June 7, 2004

1 Min Read

NEWPORT BEACH, Calif. -- Mindspeed Technologies Inc. (Nasdaq:MSPD), a leading supplier of semiconductor solutions for network infrastructure applications, today announced a family of "line card on a chip" solutions that includes the industry's first device designed to support both datacom and telecom applications in wireline and wireless networks.

The M293xx family enhances the flexibility of next-generation line cards by replacing several discrete devices, reducing cost and power requirements while saving board space. The new family is based on the design of Mindspeed's highly integrated 12-port M29320 "line card on a chip" introduced in May 2003. The family of devices will enable networking equipment manufacturers to develop higher-density multiservice cards in their switches, add/drop multiplexers/optical edge devices (ADMs/OEDs), and other systems with greater scalability, lower costs and faster time-to-market.

Mindspeed's new complete "line card on a chip" devices integrate line interface units (LIUs), framers, mappers, along with ATM and HDLC processing for datacom and STS-12 framers for telecom, providing a single-chip physical-layer (PHY) solution for aggregation and transport for ATM, packet and TDM services.

"Mindspeed is the first company in the industry to offer a single device that supports both telecom and datacom applications -- a testament to our integration capability. With the six new additions to our 'line card on a chip' family, we now provide the most comprehensive, high-density DS3/E3/STS-1 offering available in the market today for both datacom and telecom applications in wireline and wireless networks," said Dan Parsons, product line manager at Mindspeed.

Mindspeed Technologies Inc.

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