Announces construction of first phase of 300mm module at Richmond, Virginia plant

December 19, 2000

1 Min Read

MUNICH and RICHMOND, Va. -- Infineon Technologies (FSE/NYSE: IFX) today announced that in order to increase production capacity for leading-edge communication ICs, the company has decided to equip a shell now under construction in its existing Richmond, Virginia plant. Under the first phase, Infineon Technologies Richmond, formerly known as White Oak Semiconductor, will start to outfit the new module with 300 mm equipment. Leading-edge memory chips, which are currently manufactured on the 200 mm line at Infineon Technologies Richmond, will move to the 300 mm line, making existing capacity available for production of communication ICs.

“Infineon will equip the fab step by step in accordance with the demand of our customers”, commented Dr. Andreas von Zitzewitz, Chief Operating Officer of Infineon Technologies.

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