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February 26, 2013
MINNEAPOLIS -- TE Connectivity today announced that it will display a range of distributed antenna systems (DAS) and optical infrastructure solutions that create smarter small cell networks at the Mobile World Congress show, booth 6D97, in Barcelona this week. Among the innovations to be shown are:
A CPRI interface card for TE digital distributed antenna system (DAS) products that further simplifies multiband, multiservice small cell distribution. A direct CPRI interface will bring unprecedented efficiencies to DAS by eliminating unnecessary dual conversion and amplification stages from the radios to the DAS Host.
Advancements to TE’s innovative high-powered, more energy efficient DAS radio heads. These advancements include additional frequency bands and digital capacity to their +43dBm HDM solutions supporting worldwide migration to 4G services such as LTE and multi-operator neutral host networks.
TE’s new Serial Link Combiner (SLC), which increases radio-over-fiber transport capabilities to 10 Gbps. With capacity needs continuing to increase, the SLC brings efficiencies to radio-over-fiber transport, offering advantages to baseband pooling and lessening the demand for fiber fronthaul.
TE’s Rapid Fiber panel slashes small cell solution deployment costs by simplifying construction and expansion of fiber in small cell networks. Its innovative RapidReel fiber cable spool helps ensure fast cable routing and easy handling by technicians, while offering maximum equipment space savings.“Wireless networks out of necessity are moving toward small cell serving areas. TE has created solutions that lead the industry in small cell efficiency, performance, and scalability, and we are pleased to be presenting them at Mobile World Congress,” said Peter Wraight, vice president and general manager of TE’s Wireless business unit. “Our innovative approach to small cell architecture makes it easy for mobile operators to support and manage the integration of advanced service initiatives such as LTE into their network.”TE Connectivity
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