Toshiba | High | Flash Memory NAND, 16GB, MLC | $24.00 |
| High | Display Module 3.5" Diagonal, 16M Color TFT, 320 x 480 Pixels | $19.25 |
| Medium | Touch Screen Assembly Capacitive, Glass | $16.00 |
Samsung | Low | Application Processor ARM Core, Package-on-Package | $14.46 |
Infineon | Low | Baseband HSDPA/WCDMA/EDGE, Dual ARM926 and ARM7Core | $13.00 |
| Medium | Camera Module 3 Megapixel Auto-Focus | $9.55 |
Samsung (with Elpida die) | High | SDRAM - Mobile DDR 2Gb Package-on-Package (Mounted on Application Processor, Two Die) | $8.50 |
Broadcom | Low | Bluetooth/FM/WLAN Single Chip, WLAN IEEE802.11b/g, Bluetooth V2.1+EDR, with FM and RDS/RBDS Receiver | $5.95 |
Numonyx | High | Memory MCP 128Mb NOR Flash and 512Mb Mobile DDR | $3.65 |
Infineon | Low | RF Transceiver Quad-Band GSM/EDGE, Tri-Band WCDMA/HSDPA, 130nm RF CMOS | $2.80 |
Infineon | Low | GPS Receiver Single Chip, 0.13um, with Integrated Front-End RF, PLL, PM, Correlator Engine and Host Control Interface | $2.25 |
Infineon | Low | Power IC RF Function | $1.25 |
Murata | Low | FEM Quad-Band GSM, Tri-Band UMTS Antenna Switch and Quad-Band GSM RX RF SAW Filters | $1.35 |
Dialog | Low | Power IC Application Processor Function | $1.30 |
Cirrus Logic | Low | Audio Codec Ultra Low Power, Stereo, with Headphone Amplifier | $1.15 |
Rest of Bill-of-Materials* |
|
| $48.00 |
Total Bill-of-Materials |
|
| $172.46 |
Manufacturing Costs* |
|
| $6.50 |
Grand Total |
|
| $178.96 |