RadiSys Announces ATCA Platform
The Promentum SYS-6000 offers the highest density of computing resources available in a standard product platform, allowing TEMs to deliver more functionality in a smaller footprint and at a lower cost. Housed in a12U chassis, the system’s integrated shelf management is implemented in software on the switch and enables more slots to be used for revenue generating services. The Promentum SYS-6000 includes chassis interfaces that allow the highest inter-shelf bandwidth for a standards-based, multi-shelf solution in the industry as well as integrated SAN (storage area network) resources. This integrated system functionality makes the Promentum SYS-6000 an ideal platform for TEMs developing storage and compute intensive applications for carrier networks.
“Our common platform approach enables our TEM customers to deliver improved economies of scale, increased application flexibility and velocity, which results in a lower total cost of ownership to their own customers,” said Ted Ridgway, vice president of Service Provider and Enterprise Equipment at RadiSys. “The flexibility, compute density and inter-shelf bandwidth provided by the Promentum SYS-6000 allows users to offer higher performance, higher density solutions to their customers. Each of these advantages contributes to lower cost, faster time to market and better overall performance.”
---In a separate release---
HILLSBORO, Ore. -- Today, RadiSys Corp. (Nasdaq: RSYS), a leading supplier of advanced embedded systems, underscored its commitment to the AdvancedTCA® (Advanced Telecom Computing Architecture) market with its expanded Promentum™ family of AdvancedTCA-compliant products and new alliance partner program. The company’s AdvancedTCA strategy is based on its success as a strategic supplier of proven, tested, modular platforms that help TEMs (Telecom Equipment Manufacturers) reduce costs and development time associated with designing next generation communications equipment.
The AdvancedTCA standard defines a common platform architecture, enabling deployment of flexible solutions that capitalize on reusable designs and commercially available components for significant savings in development time and investment. As a Premier member of the Intel® Communications Alliance (ICA), PICMG (PCI Industrial Computer Manufacturers Group) and the SAForum, RadiSys has played a leading role it the development and adoption of standards, including AdvancedTCA.
RadiSys’ strategy is to deliver fully-integrated, application-ready AdvancedTCA platforms, allowing TEM customers to focus on attributes of their systems that differentiate their products. RadiSys believes this strategy enables its customers to leverage and multiply the impact of internal development efforts while introducing platforms faster, with reduced investment. Combining industry leading hardware, software and services with RadiSys’ unique value provides TEMs with AdvancedTCA platforms that can reduce product development time by as much as 50 percent.
“AdvancedTCA is gaining momentum and acceptance and we are committed to delivering a broad range of market-leading solutions for our customers, both internally developed and through our RadiSys Alliance Program,” said Scott Grout, RadiSys president and CEO. “Our strategy goes beyond developing AdvancedTCA building blocks and is designed to deliver a comprehensive portfolio of integrated platform solutions that meet our customers’ current and future needs. We have a rich history of providing OEMs with solutions that help them develop better products faster and more economically and will continue this performance in AdvancedTCA.”