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Agilent Technologies offers BSIM4 modeling package update for deep submicron CMOS devices used in wireless and wireline communications
May 8, 2002
PALO ALTO, Calif. -- Agilent Technologies Inc. (NYSE:°A) today introduced an RF extension to the BSIM4 Modeling Package for deep sub-micron CMOS devices used in wireless and wireline communication products, resulting in a complete DC-to-RF modeling solution.The RF extraction module, now included within the open Integrated Circuit Characterization and Analysis Program (IC-CAP) modeling software, enables highly accurate simulation of RF CMOS devices and reduces overall design time.The module is an update to the Agilent 85194K BSIM4 Modeling Package, a leading modeling solution for CMOS devices with ultra-short channel lengths that are well below 0.18 microns."RFIC designs require accurate and reliable device models, especially at high frequencies," said Jim Tabuchi, marketing manager of Agilent EEsof EDA. "The updated Agilent modeling package enables more accurate designs, fewer design cycles, lower manufacturing costs and shorter time to market."Agilent Technologies Inc.
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