Lamina Intros Packaging Technique

WESTAMPTON, N.J. -- Lamina Ceramics, Inc. has developed Low Temperature Co-fired Ceramic on Metal (LTCC-M), a multi-layer ceramic-on-metal technology that solves a host of electrical and mechanical design challenges associated with high-performance components, modules, circuit boards, and hybrid systems. By combining the best properties of ceramic and metal, the new proprietary ceramic technology provides component and packaging design engineers with a process that will significantly reduce size, lower packaging costs, and improve the electrical and thermal performance of their products. LTCC-M provides substantial price and performance improvements over LTCC, PTFE HTCC, and other substrate technologies. It delivers the high heat dissipation, high component density, and low loss characteristics necessary to satisfy the demands of next-generation components and modules with increased bandwidth and functionality. Examples of these products include high-power microwave devices, fiber optic communications systems, automotive electronic systems, and military/aerospace platforms. To address the challenges created by these products, LTCC-M utilizes a process that bonds unfired ceramic to either Kovar or CuMoCu metal. Lamina Ceramics Inc.