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Broadcom Unveils Set-Top Chip with Channel Bonding

Seeking to seize the advantage in the silicon market, Broadcom Corp. unveiled a chip for advanced digital cable set-top boxes that incorporates channel-bonding technology at the Consumer Electronics Show (CES) in Las Vegas earlier today. Broadcom officials said the new BCM 3255 chip, designed to meet the standard of the cable industry's still emerging DOCSIS 3.0 spec, can bond up to three channels at one time. They said the chip can support channel speeds of up to 120 Mbps downstream rates with multiple HD AVC streams, downloadable conditional access system (DCAS) security features, up to 1600 DMIPs of processing power and a complete home networking package. Broadcom crafted the new set-top box chip to work with its equally new BCM 7400 dual HD advanced video coding (AVC)/VC/MPEG-2 decoder chip. They said the set-top box chip can be configured to operate with either current video channels or in a channel-bonding mode. Available today in sample quantities, it's priced at $32 each in 10,000-unit volumes.
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