Axsun Modulates With CyOptics

BILLERICA, Mass. -- AXSUN Technologies Inc., a manufacturer of agile photonic subsystems, today announced a commercial Agreement with CyOptics Inc, to manufacture and qualify to Telcordia(tm) GR468, an Ultra-high performance 10Gbps Electro-absorption Modulated Laser (CyOptics Hybrid EML) module based on discrete wavelength-targeted high-power DFB laser chip and the CyOptics industry-leading electro-absorption modulator (EAM) chip. The AXSUN(tm) universal photonic packaging platform's world-class performance in optical alignment enables the combination of multiple active and passive optical devices in the same module. The packaging platform is based on micro-alignment structures and micro-optics that are specifically designed to be used with the AXSUN Micro Robot (AMR). Alignment precision in the sub-micron range is accomplished quickly by the AMR without the need for re-flowing of solder. "The performance and manufacturing cost achieved in producing these modules validates the AXSUN integration platform in the optical communications marketplace," stated Jack Kay, President and CEO of AXSUN Technologies Inc. "The AXSUN universal packaging platform gives our customers a competitive advantage by accelerating their time to market with Telcordia(tm) qualified, higher performance, low cost devices, while simultaneously lowering their capital investment and program risk." Axsun Technologies Inc.CyOptics Inc.