COPENHAGEN -- Hymite A/S announces on the upcoming ECOC event the world’s smallest TOSA/ROSA sub-assembly.

Hymite breaks size limits by presenting the smallest ever hermetic subassembly for TOSA/ROSA applications. Designed for waferscale assembly of the optoelectronics, TIA ans passives, the subassembly also has significant cost advantages. Hymite will at ECOC be presenting a ROSA sub-assembly measuring only 3,5mm x 3,5 mm x 0,7 mm, designed using the HyShell™ product series. The TOSA follows the same design rules, providing packages for VCSELs and edge emitters. And combined with small form factor receptacles, advanced optics like isolators etc., can be integrated.

“Our results will set new standards for mass-production of TOSA/ROSA packages” says CTO and Founder Jochen Kuhmann. He continues: “The TO-can is now beaten both in terms of price and performance and in addition our packages offer to integrate the electro optical components, with superior mechanical accuracy”.

The new sub-assemblies are the latest results from Hymite, who has developed a range of hermetic packaging solutionsfor optical components based on Silicon MEMS technology. The designs that are currently developed together with major industry customers, provide low-cost solutions for hermetic packaging of e.g. TOSA/ROSA sub-assemblies used in datacom or telecom optical modules, pick-ups used in optical storage and for MEMS components. All products have in common that they consequently focus on low-cost manufacturability and high yield.

As another significant development Hymite A/S announces the successful completion of the first and most critical tests in the Telcordia reliability test-suit Bellcore GR-1221-CORE. HyCap® meets or exceeds the tested environmental conditions defined in Bellcore GR-1221-CORE for hermeticity temperature cycling and high temperature storage. Residual Gas Analysis (RGA) supports the results showing a low moisture content (<2000ppm) well below the value defined in the standard MIL-STD-883E (1018.2).

Hymite expects to complete the entire Bellcore GR-1221-CORE program this fall, but is already involved in customer projects using the HyCap®, a Silicon cap for local hermetic sealing, featuring through-wafer electrical interconnects. HyCap® is an important product in Hymites product portfolio which offers unique and cost effective methods for packaging of components for data- and telecommunications, MEMS and optical storage applications.

According to Michael Kylling, VP Sales & Marketing Hymite’s future looks bright: “We see a growing demand for Hymite’s technology. Within optical packaging little innovation has happened the last 30 years. With our disruptive approach we are able to improve the key success factors in packaging and manufacturing for out customers substantially”.

Hymite A/S