Lincoln Lavoie is the senior engineer in Broadband Technologies, and serves on the Broadband Forum (BBF) Board of Directors and as the vice-chair of the Metallic Transmission Working Group of the Broadband Forum.  He is responsible for the technical management of the broadband access technology grounds, and is currently involved in the development of testing for VDSL2, G.vector, DSL bonding, and the forthcoming G.fast.