Teknovus Names Chairman

PETALUMA, Calif. -- Teknovus, a provider of semiconductors for broadband access networks, today announced that Michael J. Callahan has joined the company as Chairman of the Board. Before joining Teknovus, Mr. Callahan served as Chairman, President, and CEO of Waferscale Integration, President of Monolithic Memories, and held various senior management positions at Advanced Micro Devices and Motorola. Mr. Callahan is a graduate of the Massachusetts Institute of Technology and a veteran of the United States Marine Corps.

"Mike Callahan brings a wealth of knowledge to Teknovus,” said Gerry Pesavento, President and CEO of Teknovus. “With his broad background in the semiconductor industry and his leadership skills, I am confident that we will be able to capitalize on the great beginning that Teknovus has already made, and quickly secure a position as a top supplier of carrier-class broadband access chipsets."

Callahan said, "With its innovative products and 50 customers, Teknovus is off to an amazingly fast start. Teknovus EthernetPlus(TM) and EthernetPON chipsets have already been designed into broadband access equipment solutions for major customers. This is an excellent team, and I look forward to guiding Teknovus as it grows into a major player in the semiconductor industry.”

Teknovus Inc.