S7022 and S7025 chipset can be used with other AMCC devices to provide optical backplane solutions ranging from OC3 to XAUI rates

February 21, 2001

1 Min Read

SAN DIEGO -- Applied Micro Circuits Corp. (AMCC) [NASDAQ:AMCC], a leader in high-bandwidth silicon connectivity solutions for the world's optical networks, today announced the enhancement of the S7022 and S7025 chipset for 3.2 Gbps optical backplane applications. The S7022 is a 3.2 Gbps Quad Vertical Cavity Surface Emitting Laser (VCSEL) driver and the S7025 is a 3.2 Gbps Quad transimpedance amplifier (TIA), with integrated limiting amplifier and Loss of Signal (LOS) detection circuitry. The chipset can be used in optical backplane links up to 300 meters for rack-to-rack, chassis-to-chassis, and board-to-board connectivity. These products were developed to address low power, low cost and small form-factor requirements, provide exceptional performance for parallel fiber and WDM modules, and were designed for compliance with IEEE's 802.3z specifications. Moreover, this chipset can be used with other AMCC devices to provide flexible optical backplane solutions in applications ranging from OC-3 (155 Mbps) to XAUI (3.2 Gbps, eXtended Attachment Unit Interface for 10-gig Ethernet Standard from IEEE) rates.

"The enhancement of the S7022 and S7025 chipset enables higher optical backplane speeds for greater bandwidth density," said Paul Duran, AMCC's product marketing manager. "This technology coupled with advancements in optical modules provides plug-and-play backplane solutions for applications requiring more bandwidth at a lower cost and power per port."

http://www.amcc.com

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