Complementary TranSwitch and Octasic semiconductor devices deliver high-density voice gateway card

February 15, 2005

1 Min Read

SHELTON, Conn. and MONTREAL –– TranSwitch® Corporation (NASDAQ: TXCC), and Octasic Semiconductor Inc. today announced an integrated solution for voice over packet (VoP) gateway implementations that allows OEMs to increase density and lower costs. Through the complementary fit and functionality of the TranSwitch TEProä, Octasic OCT8304 and OCT6100 devices, the two semiconductor vendors are able to implement a gateway's voice plane functionality on a single card, using only three chips, resulting in a faster time to market for OEMs.

The companies also announced that a leading manufacturer of PON optical line terminals (OLT), used to enable fiber-to-the-premises (FTTP), has completed its design and field trials of a retrofittable DS3-rate high-density VoATM gateway using the TranSwitch/Octasic solution.

“TEPro has proven to be an ideal TDM network interface device for voice gateways,” said Brian Stroehlein, product marketing manager for TranSwitch. “By combining TEPro with Octasic’s voice over packet (VoP) and echo cancellation (EC) devices on a common H.110 bus, OEMs can rapidly implement high density VoP gateways.”

The Octasic and TranSwitch devices are interconnected seamlessly with their common H.110 interfaces. Originally designed for cPCI applications incorporating a TDM backplane, H.110 is also usable as a device-to-device interconnect, enabling the full-duplex transfer of over 2,000 voice channels across one bus.

TranSwitch Corp.

Octasic Inc.

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