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The company changes its name as it goes after the market for hybrid integration of chips
November 11, 2004
Merrimack, N.H. -– Xanoptix®, a technology leader in 3D semiconductor integration and transceiver hybrid integrated circuits for high-density parallel optics modules, today announced it has changed its corporate name to Xan3D Technologies™.
”We chose to rename our company to more clearly reflect our core technology of the most advanced three-dimensional integration available for semiconductor technology," said Russ Johnsen, Executive Chairman of Xan3D Technologies. " Utilizing our semiconductor technology and manufacturing processes we will continue to offer the Xan-Optix Transceiver Integrated Circuit, as well as other design and manufacturing solutions for high-density three-dimensional integrated circuits.”
Xan3D’s unique integration process provides significant, inherent benefits such as: high connection density, up to 8 million contacts per square centimeter, material flexibility, compatibility with semiconductor and optoelectronic processes, robust thermal properties, shear strengths of 1,600 kg/cm2, scalability, and cost-efficient manufacturability.
Xan3D Technologies
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