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Partners with Motorola to develop a complete shop-floor information solution for electronics assembly and test, plus new products
January 22, 2002
PALO ALTO, Calif. & SCHAUMBURG, Ill. -- Agilent Technologies Inc. (NYSE:A) and Motorola, Inc. (NYSE:MOT) today announced an agreement that is expected to result in a complete shop-floor information solution for electronics assembly manufacturing and test. The combination of Agilent capabilities in manufacturing test with Motorola capabilities in manufacturing monitoring is expected to result in reduced costs and downtime for electronics manufacturers. The combined solution is based on the Agilent Intelligent Test Framework, Agilent's software platform that allows for data sharing between test and repair, and Motorola's suite of Manufacturing Execution System (MES) products, including Manufacturing Pulse(TM), Manufacturing Intellitrak(TM) and Manufacturing Balance(TM). The solution addresses pre-production optimization and complete line build, including screen-printing through process inspection and electrical test. "Motorola's suite is the most comprehensive factory-in-line process suite we've seen," said Kamran Firooz, vice president and general manager of Agilent's Manufacturing Test Business Unit. "The combined application of Agilent Intelligent Test Framework and Motorola MES products creates a solution unmatched in quality, experience and capability." "For much of electronics manufacturing history, Agilent has been the de facto standard in Electronics Test and Inspection," said John Kivlin, Motorola's director of Manufacturing Software Strategic Business Unit. "Leveraging Motorola's experience and innovative manufacturing software applications with Agilent provides powerful solutions for our customers." Agilent Intelligent Test Framework (ITF) is a communication platform that links Agilent's industry-leading test equipment. This platform is a proven solution that optimizes PCB (printed circuit board) manufacturing test by making test and repair information available across testers and repair stations. Popular with Agilent customers worldwide, ITF is built on IPC XML standards that allow applications to easily access test and repair information. Motorola's MES software captures real-time data from process equipment supplied by all major vendors and from test and inspection equipment through the Agilent ITF. Production data and reports are then made available to line operators, manufacturing engineers and management. This data provides the information necessary for line-level optimization along with enterprise-level and supply chain process improvement, all required to reduce cost and downtime, in addition to improving yields and business results. In a separate release: Agilent Technologies Inc. (NYSE:A) today introduced a new test suite for designers and manufacturers of printed circuit boards that addresses the need for faster development and deployment of complex, limited-access printed circuit boards (PCBs) such as those used in communications and high-end computing. The new ScanWorks(TM) Boundary-Scan Solutions for the 3070 in-circuit test (ICT) system offer a full suite of tools for volume manufacturing environments. The new ScanWorks for the 3070 can be used to test the quality of PCBs, to diagnose faults and to program semiconductor devices on the PCBs. And, with ScanWorks for the 3070, board designers can transfer their benchtop boundary-scan tests and device programs directly to the Agilent 3070 ICT system, saving as much as two weeks in time to market. In a separate release: Agilent Technologies Inc. (NYSE:A) today introduced a new solder-paste inspection system for printed circuit board assembly. The Agilent SP50 automated optical inspection (AOI) system for surface-mount technology (SMT) electronics production is expected to improve product yields throughout the manufacturing process. "With increased density of components and advanced area array devices on printed circuit boards, correct solder-paste application is an increasingly critical production step," said Kamran Firooz, vice president and general manager of Agilent's Manufacturing Test Business Unit. "Our newest entry to Agilent's Intelligent Test portfolio accurately inspects solder-paste deposits to the most demanding requirements, and still beats the cycle rate of most production lines." In a separate release: PALO ALTO, Calif. -- Agilent Technologies Inc. (NYSE:A) today introduced its next-generation automated X-ray test system for printed circuit board assemblies (PCBAs). Detection improvements featured in the Agilent 5DX Series 5000 offer electronics manufacturers more comprehensive and accurate fault coverage, resulting in a higher quality of shipped products. The 5DX Series 5000 also offers usability and implementation features that result in a much faster time to market. "Agilent continues to invest in intelligent test and inspection technologies that enable the success of our customers," said Kamran Firooz, vice president and general manager of Agilent's Manufacturing Test Business Unit. "Manufacturers continue to face 'impossible' challenges with advancing technologies and economic realities. They can trust Agilent to support them with the breakthrough manufacturing test solutions they need, consistently and reliably." Agilent Technologies Inc.
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