WASHINGTON – Today, the Department of Commerce's National Telecommunications and Information Administration (NTIA) awarded nearly $5.5 million in the first round of grants from the Public Wireless Supply Chain Innovation Fund.
The $1.5 billion Wireless Innovation Fund supports the development of open and interoperable wireless networks as part of the Biden-Harris Administration's Investing in America agenda.
Open and interoperable wireless equipment will help drive competition, strengthen global supply chain resiliency and lower costs for consumers and network operators.
The shift to open and interoperable networks is vital for our national and economic security. The development of new, open-architecture approaches to wireless networks will help to ensure that future wireless equipment is built by the U.S. and its global allies and partners – not vendors from nations that threaten our national security.
This first round of funding will support R&D and testing activities related to evaluating energy efficiency, measuring performance of interoperable equipment and testing methods for sharing spectrum.
The funding totaled $5,482,052 and was awarded to projects at Northeastern University, New York University, and DeepSig Inc.
Innovation Fund Director Amanda Toman announced the awards at an event with Northeastern University.
Funded by the CHIPS and Science Act of 2022, the Innovation Fund will invest $1.5 billion over the next decade to support the development of open and interoperable networks. NTIA will make up to $140.5 million in grants available on a rolling basis from the first round of funding.
Read the full press release here.
NTIA