Corning introduces HPFS 8650, new optical material for the semiconductor industry

February 21, 2006

1 Min Read

CORNING, N.Y. -- Corning Incorporated (NYSE:GLW) today announced the introduction of HPFS® 8650, a new high-purity optical lens material for semiconductor microlithography, designed to support the performance requirements of polarized 193nm immersion lithography systems. HPFS 8650 exhibits high resistance to laser damage at 193nm, low compaction, no expansion, and low polarization-induced birefringence. In addition, the new material offers improved index homogeneity, low initial birefringence with no systematic pattern and high transmission. The stable, predictable behavior of the product under 193nm laser exposure enables it to support the throughput requirements of immersion lithography systems.

This introduction positions Corning for performance leadership in 193nm immersion lithography lens material. It also complements Corning's leading brand of fused silica, HPFS® 7980, which is already widely used in 248nm lithography. "With the introduction of HPFS® 8650, Corning continues to support the growth of the semiconductor industry through advanced optical materials and materials-based solutions," commented Dr. Michael Pambianchi, product line manager, Corning Semiconductor Materials. He continued, "Corning also supplies pre-finished mirror blanks used in immersion lithography systems to achieve high numerical apertures."

Corning Inc. (NYSE: GLW)

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