Gore Unveils Low-Loss Microvia Material

ELKTON, Md. -- W. L. Gore & Associates, Inc., a leading provider of PCB and packaging substrate materials, launches the new MICROLAM® 630 dielectric, the lowest-loss microvia material affording the best cost/performance solution for high frequency microvia modules and PCBs. This high performance material consists of standard BT resin in a continuous toughening matrix.MICROLAM 630 dielectric provides superior thickness uniformity for controlled impedance designs, CAF reliability, buried via filling capabilities, and excellent surface planarization for high-density applications. Its low dielectric constant (2.6) and loss tangent (0.004) are stable throughout a broad range of frequencies (1 MHz to 40 GHz) and temperatures (-55 to +200°C.) In addition, its low dielectric constant allows thinner dielectric layers, offering improved microvia aspect ratios and laser drilling throughput 3x faster than glass prepregs. These attributes provide cost competitive solutions for high volume applications.Manufactured in high volumes and supplied in either standard sheet sizes or rolls, the material offers electrical properties and thermo-mechanical reliability designed to meet both cost and performance requirements. Typical applications include WLAN, Bluetooth and power amplifier RF modules, MCMs, wireless transceivers, optical modules, and high-speed telecom and computing microvia PCBs.W.L. Gore & Associates Inc.