Qualcomm Unveils Advanced Global LTE Chip
NEW YORK -- Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., introduced its fourth-generation 3G/LTE multimode solutions with the newest modem chipset, the Qualcomm Gobi 9x35, and RF transceiver chip, the Qualcomm WTR3925, designed for industry-leading 4G LTE Advanced mobile broadband connectivity. Both products are fourth-generation 3G/LTE multimode solutions from Qualcomm Technologies and offer significant improvements in performance, power consumption and printed circuit board area requirements.
The Qualcomm Gobi 9x35 is the first announced cellular modem based on the 20 nm technology node with support for global carrier aggregation deployments up to 40 MHz for both LTE TDD and FDD Category 6 with download speeds of up to 300 Mbps. The Gobi 9x35 is backwards compatible and supports all other major cellular technologies, including DC-HSPA, EVDO Rev. B, CDMA 1x, GSM and TD-SCDMA. The Qualcomm WTR3925 is the first announced RF transceiver chip based on the 28 nm process, and is Qualcomm Technologies' first single-chip, carrier aggregation RF solution that supports all carrier aggregation band combinations approved by 3GPP. The WTR3925 pairs with the Gobi 9x35 chipset and the Qualcomm RF360 Front End Solution, which enable the mobile industry's premier global, single-SKU LTE platform.
Qualcomm Inc. (Nasdaq: QCOM)