PMC-Sierra and Taiwan Semiconductor Manufacturing Co. collaborate to develop system-on-chip products with higher levels of integration

December 19, 2001

1 Min Read

BURNABY, British Columbia -- PMC-Sierra (Nasdaq:PMCS), a leading provider of broadband semiconductors, and Taiwan Semiconductor Manufacturing Company (TSMC) (NYSE:TSM), a world-leading foundry, today announced a collaboration to develop system-on-chip (SoC) products using advanced 0.13-micron technologies. PMC-Sierra's system-on-chip devices demonstrate the highest levels of integration using CMOS technologies, supporting multiple 3.125 Gbit/s Serial Links, SSTL2 interfaces, more than 12 Mbit of embedded SRAM, RISC Cores and greater than 4 Million logic gates on a single chip. "Our 0.13-micron process is the industry's most advanced technology in volume production," said Rick Tsai, TSMC president. "To date, we have delivered 33 fully functional 0.13-micron products to our customers and expect to receive over 60 production tapeouts by the end of the year. Our process technology roadmap helps companies ramp leading-edge architectures, such as PMC-Sierra's MIPS-based processor products, quickly to volume production." PMC-Sierra Inc. Taiwan Semiconductor Manufacturing Company (TSMC)

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