DiCon Intros 8x8 Switch

DiCon is releasing a new Low-Cost MEMS 8x8 Matrix Switch Module

January 17, 2006

2 Min Read

RICHMOND, Calif. -- DiCon Fiberoptics Inc., a leadingmanufacturer of fiberoptic components, modules, and test instruments, isannouncing a new Low-Cost MEMS 8x8 Matrix Switch Module. The new modulewill be shown at OFC/NFOEC 2006, at the Anaheim Convention Center (March7-9, 2006). The 8x8 Matrix Switch Module is based on DiCon’s MEMS 1x8Optical Switch component. Sixteen of the MEMS 1x8 switch components areused in a fully non-blocking (strict sense) two-stage configuration.Eight MEMS 1x8 switches provide fan-out from the eight input fibers, andare interconnected to eight MEMS 8x1 switches that provide fan-in to theeight output fibers. Each MEMS 1x8 switch is based on amicro-electro-mechanical system (MEMS) chip, as used in DiCon’s familyof MEMS 1xN Switch components. Each MEMS chip consists of a “3D”electrically movable mirror on a silicon support. Voltages applied tothe MEMS chip cause the mirror to rotate on two independent axes, whichchanges the coupling of light between a common fiber and eightinput/output fibers. The MEMS 1x8 Switch component features lowinsertion loss, low power consumption, excellent repeatability, and Cand L band operation. It is a non-latching device that acts as a shutterwhen electrical power is removed.

The Low-Cost MEMS 8x8 Matrix Switch Module uses a new housing designthat incorporates a modular fiber-tray design for reduced integrationtime and manufacturing cost. The module includes electronics to controlthe operation of each switch component, as well as the overall state ofthe switch matrix, over the customer’s choice of serial interfaces (I2C,RS232, or RS485). Evaluation software allows drag-and-drop set-up andtear-down of optical switch paths. Using discrete MEMS switches, theMEMS 8x8 Matrix Switch Module offers low insertion loss (< 1.5 dB),excellent return loss and crosstalk isolation, low power consumption(less than 200 mW), and support for high optical power levels (500 mW),compared to “free space” 3D MEMS switches. The module has a form factorof 150mm x 150mm x 25mm (6” x 6” x 1”). For customers who require aneven smaller footprint, DiCon also offers a Compact MEMS 8x8 MatrixSwitch Module, with a reduced form factor of 102mm x 76mm x 25mm (4” x3” x 1”).

Low-Cost MEMS 8x8 Matrix Switch Module

DiCon’s 1xN and MxN Optical Switch Modules can be implemented in a broadrange of sizes and configurations, using varying quantities and types ofMEMS 1xN switch components. The use of module-level integration enablesrapid development of custom configurations for Optical Cross-Connect(OXC) and optical switching functions, for telecom, defense, and otherindustrial and research applications. Multiple MxN Switch Modules canbe interconnected to implement larger all-optical multi-stage switcharchitectures.

DiCon Fiberoptics Inc.

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