Broadcom Intros 10-GigE Switch Chip

IRVINE, Calif. -- Broadcom Corporation (Nasdaq: BRCM - News), the leading provider of silicon solutions enabling broadband communications, today announced the Broadcom® BCM5673, the industry's first 10 Gigabit Ethernet (10GbE) multi-layer switch that delivers wire-speed Layer 2 through Layer 7 switching and routing capabilities over cost-effective 10GBASE-CX4 copper medium (CX4). As the latest addition to Broadcom's field- proven StrataXGS(TM) product family, this highly integrated single-chip device, enables system manufacturers for the first time to build stackable 24- and 48-port Gigabit Ethernet (GbE) switches with multiple 10GbE interfaces in a compact 1U form factor (standard unit height of approximately 1.75 inches).

The rapid transition from Fast Ethernet to Gigabit Ethernet for desktop and notebook computers has accelerated the need for GbE stacking switches in the wiring closet. In addition, network administrators continue to deploy servers with GbE in data centers. To meet the demand for this increase in cumulative bandwidth, today's enterprise networks require affordable and reliable 10GbE uplinks for data aggregation and routing at the core of the network. With the new IEEE 802.3ae-compliant BCM5673 device, network administrators can now deploy feature-rich and economical 10GbE systems into the enterprise.

The BCM5673 integrates a CX4-compatible 10GbE Attachment Unit Interface (XAUI) SerDes (serializer/deserializer) making it an ideal solution for compact 10GbE stackable systems. Solutions prior to the BCM5673 required optical components and complex subsystems, resulting in significantly higher costs with less reliability. The CX4-compatible SerDes enables the transmission of 10GbE over low cost, standard copper media as well as fiber. This allows equipment manufacturers to build systems with 10GbE interfaces at a fraction of the cost of current, expensive optical solutions.

The BCM5673's integrated architecture combines a packet buffer memory, on-chip address tables and high-performance SerDes in a single device, significantly reducing the number of components necessary in a 10GbE switch. Competitive 10GbE silicon solutions usually require standalone SerDes, a minimum of four external memory devices and a fabric interface chip, resulting in at least seven components per 10GbE port. By integrating the functionality of multiple chips into a single-chip solution, Broadcom's new BCM5673 device reduces system manufacturing cost, board space and power requirements, thereby allowing equipment manufacturers to build small form-factor 10GbE uplink modules as well as high-density 10GbE switch systems.

The unique ContentAware(TM) network processing capabilities of the BCM5673 provide Layer 2 through Layer 7 per packet intelligence. This extremely flexible on-chip classification processor empowers network administrators to simultaneously deploy voice, video and data in IPv4 and IPv6 networks. Furthermore the device enables complex, content-based access control lists (ACLs) for implementing security features, such as denial of service attack blocking, intrusion detection and wireless authentication.

"Broadcom's BCM5673 delivers complete wire-speed, Layer 2 through Layer 7 support, and makes the deployment of affordable 10 Gigabit Ethernet in the enterprise a reality," said Martin Lund, Senior Director of Broadcom's Enterprise Switching LOB. "The BCM5673 marks the latest advancement in our widely-adopted StrataXGS product family and underscores Broadcom's position as a technology leader with the ability to continually provide feature-rich, highly integrated products that advance the networking industry."

"Integrating CX4 technology is an important step in creating a cost- effective, single-chip answer for next-generation enterprise networking equipment," said Dan Dove, principal engineer, HP ProCurve Networking. "HP believes that this type of robust, standard copper-wire solution will help drive the adoption of 10 Gigabit Ethernet into the enterprise network by offering an alternative to cost-prohibitive, optical-based products."

The BCM5673 is a dual-port switch, with a 10GbE port and a HiGig(TM) uplink port for complete interoperability with other StrataXGS products, including high-density switch fabrics and GbE multi-layer switches. The device supports line rate switching and routing for all packet sizes, including jumbo frames. Offered in a 400-pin PBGA package, the device utilizes 0.13-micron CMOS process technology and yields a power consumption of less than 4W.

The device features an integrated CX4-compatible XAUI transceiver that allows for direct connection to copper cables, Xenpak, XPAK and X2 modules without the need of additional components. In combination with Broadcom's BCM8703 transceiver, the BCM5673 also supports the increasingly popular XFP modules and provides system manufacturers the flexibility in choosing a convenient and economical physical interface.

The BCM5673 reduces system development time and accelerates customer time- to-market by leveraging customer software previously developed for the StrataXGS common application programming interface (API). Broadcom also offers complete software development kits (SDK) and reference designs for the BCM5673, including software, schematics, layout files and related documentation.

Samples of the BCM5673 are currently available to customers with production quantities expected by the end Q3 of 2003. Pricing is available upon request.

Broadcom Corp.