Sibercore, UMC Make High-Density ChipSibercore, UMC Make High-Density Chip

OTTAWA and HSINCHU CITY, Taiwan -- SiberCore Technologies, the leader in providing silicon-based packet management products and solutions to the Internet infrastructure market, and United Microelectronics Corporation (NYSE: UMC), a world-leading semiconductor foundry, today announced the successful fabrication and delivery of the world's highest density Ternary Content Addressable Memory (TCAM) integrated circuit. SiberCore's latest and most advanced product, the SiberCAM(TM) Ultra-9M, was fabricated using UMC's 0.15-micron technology and has demonstrated excellent initial yields. The Ultra-9M utilizes the foundry industry's smallest SRAM cells (3.15 square-micron), enabling over 9.4 million ternary storage elements to be integrated with significant amounts of network processing logic elements in a single chip. In addition to achieving the industry's highest density, the SiberCAM Ultra-9M also delivers advanced, patent-pending features including a three-port architecture and dynamically variable word-width support for 36-, 72-, 144- and 288-bit wide words. The Ultra-9M provides the highest packet look-up speeds on the market, supporting up to 100 million searches per second (MSPS) for 36-, 72- and 144-bit wide searches and 50 MSPS for 288-bit searches, independent of table update activity. These features and performance make the Ultra-9M the industry's most advanced and highest density ternary CAM available today. A detailed product announcement of the Ultra-9M will be forthcoming early in the summer of 2001. "It is through our close working relationship with a leading foundry partner like UMC that we are able to realize these ambitious performance and feature targets," said Dr. Ken Schultz, SiberCore's President and CEO. SiberCore Technologies United Microelectronics Corp. (UMC)