IRVINE, Calif. -- Newport Corporation (Nasdaq:NEWP - news) today announced that it has been issued its second U.S. patent in a series of patent applications that extend the company's leadership in next-generation technology in the fabrication of semiconductor equipment products. Newport's U.S. Patent No. 6,275,748, covering improvements in 300 millimeter edge-grip robotic end effectors, includes technology that allows semiconductor equipment manufacturers to efficiently and reliably handle 300 millimeter wafers during fabrication and testing. The patent strengthens and deepens Newport's protection of its intellectual properties in this field and represents one of several relating to the technology of providing edge grip mechanisms for use in the semiconductor equipment industry."This invention continues to build on our broad range of technologies used to enable semiconductor equipment manufacturers to increase their system yields by minimizing the potential for wafer mishandling damage and eliminating back side contamination problems," said Paul Bacchi, co-inventor and general manager of Newport's operations in Richmond, California. "The importance of this technology becomes more critical as the industry moves toward sub 0.15 micrometer features and larger diameter 300 millimeter wafers."Newport Corp.