Broadcom Intros 10-Gig DWDM Chip

IRVINE, Calif. –- Broadcom Corporation (Nasdaq: BRCM), theleading provider of integrated circuits enabling broadband communications,today announced a 10-Gigabit per second (Gbps) Dense Wavelength DivisionMultiplexing (DWDM) Transport Processor. This breakthrough device willalleviate the space and power constraints urgently needed in serviceproviders’ central offices by enabling the development of compact, low powerDWDM equipment that increases the number of wavelengths from 100 to 200 onan existing, single strand of fiber.Leveraging its CMOS transceiver and system on a chip (SoC) technology,Broadcom is setting a new industry standard in integration, power reductionand flexibility. The BroadcomÒ BCM8511 Transport Processor integrates adigital wrapper, Forward Error Correction (FEC), and a SONET/SDH framer withperformance monitoring logic and a serial 10 Gbps transceiver into a singlechip. This unprecedented level of integration results in one-third thepower and one-quarter the board space of today’s most highly integratedcompetitive alternatives. This will enable equipment manufacturers todramatically increase the port density of their 10 Gbps optical transportequipment. In addition, the high degree of programmability embedded in thechip will enable a new level of network operations and maintenanceflexibility unparalleled by today’s systems.“As DWDM brings increased bandwidth to existing fiber-optic networks, powerand heat management in co-located facilities has become a major concernamong service providers,” said Allen Leibovitch, Director of CommunicationsSemiconductors at RHK, Inc. “The integration of a transceiver, digitalwrapper, and other overhead processing functions into a single chip allowsmanufacturers to build lower power, high channel count DWDM systems.”Broadcom Corp.