OTTAWA -- Zarlink Semiconductor (NYSE/TSX:ZL), with the launch of three low-density CES (Circuit Emulation Services)-over-Packet processors, now offers the industry's only end-to-end portfolio of circuit-to-packet devices.

The three-chip ZL50120 family utilizes CES-over-Packet technology to seamlessly "tunnel" one, two or four streams of TDM (Time Division Multiplex) voice, video and data traffic, with associated timing and signaling, across Ethernet, IP (Internet Protocol) and MPLS (Multiprotocol Label Switching) networks. Complementing the ZL50111 family of high-density CES-over-Packet processors, Zarlink delivers circuit-to-packet bridging devices that handle from one to 32 streams of TDM traffic.

"Dealing with the transport of legacy services is an important element in the rollout of Enterprise packet networks," said Jeremy Lewis, product line manager, Packet Processing, Zarlink Semiconductor. "With our new low-density packet processors, carriers can build out cost-effective packet networks to the Enterprise, without service disruptions to, or requiring significant infrastructure upgrades from, their customers."

Zarlink Semiconductor Inc.