MONROVIA, Calif. -- Xponent Photonics, the leading innovator of optical component cost reduction, today announced a suite of bi-directional products for FTTx applications based on its patented Surface Mount Photonics(SMP) technology. Xponent's triplexers and diplexers offer leading performance while reducing customers' assembly and manufacturing costs. The first three of these products (G-EPON diplexer, BPON triplexer, and 1310/1310/1550 triplexer) are currently available for sampling.

Xponent's FTTx products include:

As FTTx systems and module vendors begin to ramp volumes to meet the rapidly growing demand for PON deployments, they need to reduce the cost of their systems while at the same time improving product quality and consistency. Xponent's Surface Mount Photonic technology eliminates the cost, complexity and quality problems that plague legacy TO-can assemblies. By eliminating hermetic packages, active alignments and extensive test procedures, Xponent has driven the largest costs out of optical components without sacrificing performance or reliability. Printed circuit board (PCB) assembly costs are also lower than with TO-can based components largely because of Xponent's flex circuit leads. Xponent's highly automated flex-circuit-to-PCB attachment process improves consistency, reduces touch time, and improves reliability for customers while reducing assembly costs. Furthermore, SMP-based products eliminate costs associated with the secondary shielding and tuning required for TO-can products.

Leading crosstalk specifications enable Xponent to address one of its customers' most significant performance challenges. For example, the GEPON diplexer typically exhibits a receiver sensitivity of -28 dBm with only 0.1 dB of receiver sensitivity impairment with the laser turned on. TO-can based solutions typically show 0.5dB or more crosstalk impairment under the same test conditions.

"Xponent takes a comprehensive view of our customers' needs. We don't stop at delivering optical components with superior performance for lower cost. We also minimize downstream assembly expenses for our customers through packaging and manufacturing innovations and help to minimize our customer's engineering costs by providing reference designs and design-in support," said Jeff Rittichier, Xponent's President and CEO.

Xponent Photonics Inc.