SAN JOSE, Calif. -- Xilinx, Inc. (Nasdaq: XLNX - News), the industry leader in programmable logic solutions, today reported that the company is shipping the world's first 90 nanometer (nm) programmable chips. By fully exploiting the industry's most advanced chip-making process technology at 90nm, Xilinx has reached unprecedented field programmable gate array (FPGA) price-performance levels.

A successful partnership strategy with IBM (NYSE: IBM - News) and UMC (NYSE: UMC - News) has put Xilinx at the forefront of the semiconductor industry's race to 90nm. Functional chips have been produced at both IBM and UMC. Because 90nm* device geometries enable more transistors in a smaller area, Xilinx has reduced die size with this new generation of FPGAs by up to 80 percent, compared to competing 130nm programmable logic solutions. In turn, the company will be able to drive pricing down to below $25** for a one-million-gate FPGA (approximately 17,000 logic cells), which represents a 35 to 70 percent savings compared to any competitive offering.

"Together with UMC and IBM, Xilinx has made a significant investment in driving the most advanced 90nm chip-making processes and 300mm*** wafer technology to reduce FPGA costs for our customers, while drastically increasing device densities and functionality," said Wim Roelandts, Xilinx president and CEO. "Our unwavering commitment to develop leading edge semiconductor manufacturing processes has been a key component of the company's success as the industry leader in programmable logic for many years. Today's 90nm news is another major step for Xilinx in delivering the time-to-market benefits of programmable logic 'to the masses' and expanding into new applications."

Xilinx Inc.

IBM Corp.

United Microelectronics Corp. (UMC)