Broadcom ushers in next wave of communications convergence by shipping flagship WiFi + Bluetooth + FM solution to customers

July 23, 2008

2 Min Read

IRVINE, Calif. -- Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, is ushering in the next wave of communications convergence for mobile devices. The company is now shipping its flagship wireless combination chip, the Broadcom(R) BCM4325, in production volumes to leading manufacturers of mobile phones and other consumer devices, with end-products expected to appear on store shelves later this year. As consumers demand mobile devices that provide seamless connectivity to the Internet, broadcast content and peripherals, manufacturers are looking for single-chip solutions that combine communications technologies. Multi-function chips, such as the BCM4325, will account for nearly one-third of all wireless connectivity solutions shipped in 2012 -- underscoring the huge opportunity for companies that can successfully deliver such devices*.

Broadcom's award-winning** BCM4325 was the first connectivity solution to combine Wi-Fi(R), Bluetooth(R) and FM functionality into a single 65 nanometer (nm) silicon die, significantly reducing the board space and power consumption typically required to add all three wireless features to mobile devices. The highly integrated BCM4325 chip also features several breakthrough capabilities that provide better Wi-Fi and Bluetooth performance than discrete solutions. The company is already sampling its second generation combo solutions, which leverage advanced technologies to provide richer communications and connectivity for next generation products. Examples of future functionality could include 802.11n for multimedia and gaming products, GPS for personal navigation devices (PNDs), low energy Bluetooth technology for sensor applications and other technologies in development.

"When it comes to integrating more functions into a single silicon die, few companies can bring together all of the technologies needed to deliver combo devices with uncompromised performance," said Chris Bergey, Director of Broadcom's Embedded Wireless line of business. "Having shipped hundreds of millions of Wi-Fi and Bluetooth chips, Broadcom not only has the market leading silicon, but also offers unique software expertise to ensure that these technologies work well together. This has generated a considerable amount of design momentum in several high-volume consumer markets."

Broadcom Corp. (Nasdaq: BRCM)

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