SHELTON, Conn. -- TranSwitch® Corporation (NASDAQ: TXCC), a leading provider of high-speed Broadband, Transport and Switching semiconductor solutions for voice, data and video communications, today announced the ability of its EtherMap® family of products to operate in industrial temperature range opening up new opportunities in the fast-growing micro MSPP (multi service provisioning platform) market.

TranSwitch’s EtherMap-3Pt, EtherMap-3 Plus, EtherMap-12 and EtherPHAST™-48 were designed with a robust memory controller with wider timing margins to ensure compatibility with industrial temperature-rated SDRAM (Synchronous Dynamic Random Access Memory) in BGA (ball grid array) packages with capacities up to 256Mb.

“This ability to handle industrial temperature range has enabled us to achieve an additional upside in gaining sockets for OC-3 and OC-12 Ethernet-over-SONET/SDH (EoS) applications among top tier OEM customers worldwide,” said Rob Schwaber, product marketing manager for TranSwitch. “Components need to be broader in their temperature tolerance ranges for more integrated smaller form factor platforms located farther out in the network in harsh environments.”

The industrial-rated SDRAM controllers in the EtherMap and EtherPHAST chips allow OEMs to streamline their manufacturing process and achieve greater yields. This is based on populating boards with uniform components in preferable BGA packaging where the overhead of second run reflow/remount is not required as it is for other package types such as TSOP (Thin Small Outline Package).

TranSwitch Corp.