Teradyne Touts Backplane Design

September 18, 2001

1 Min Read

NASHUA, NH -- Teradyne, Inc. (NYSE: TER) Connection Systems Division (TCS), a leading manufacturer of high-speed/high-density interconnects, multi-gigabit custom backplanes, and high-performance systems integration and test, today announced its DFM Guideline for Backplane Assembly. The guideline is the first of a suite of design for manufacturability (DFM) tools from TCS that will improve system reliability and reduce time to market for manufacturers of telecom, computing, and Internet infrastructure equipment. As an electronics manufacturing services (EMS) provider, Teradyne Connection Systems is unique in offering a detailed level of design assistance in its DFM guidelines. This added design support compliments the division's technology focused vertical integration and supplements the face-to-face design work performed by TCS's Field Applications Engineers for customers to help produce the best design on the first pass. Teradyne's DFM tools provide a framework to streamline the system design cycle, allowing Teradyne and its customers to focus more on perfecting the system design at its concept stage and therefore invest less time and money building prototypes. This enhanced design collaboration with customers identifies robust, automated processes that reduce defects, improve system reliability, and get the system to market faster. "Our DFM tools help Teradyne and our manufacturing partners to identify and resolve assembly and production related issues early in the design cycle," said Dan Murphy, VP of Sales and Application Engineering. "Evaluating the manufacturability of a system during the design cycle will help our customers reduce delays down the line, and that translates into significant cost savings on materials and labor as well as reduced time-to-market." Teradyne Inc.

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