NASHUA, N.H. -- Teradyne, Inc., (NYSE:TER) Connection Systems Division, a global supplier of high-performance connectors, multi-gigabit backplanes, and system integration and test services, today announced it has joined the High Speed Backplane Initiative (HSBI), a group of communications companies developing serial link technology capable of sending data at rates of 4.976 to 6.375 Gb/s across a backplane environment up to a distance of 30 inches including two connectors. As increasing bandwidth needs drive higher backplane link speeds, all components of the system need to be addressed. Teradyne's high-speed, high-density connectors, such as VHDM-HSD(tm) and GbX(tm), currently support data rates up to 10 Gb/s. In addition, the company has advanced printed circuit board design and manufacturing capabilities as well as relationships with several semiconductor companies in order to best support this need for an integrated solution. "Teradyne is committed to driving technology forward in response to our customers needs," said Tom Pitten, development engineering manager at Teradyne Connection Systems. "Our participation in HSBI is further demonstration of our commitment to providing integrated system solutions." Teradyne Inc. High Speed Backplane Initiative (HSBI)