April 6, 2011
AUSTIN, Texas -- After completing the assessment of its Sendai, Japan wafer fabrication facility following the recent earthquake, Freescale Semiconductor today announced that it will not reopen the seriously damaged facility.
The March 11th 9.0 magnitude earthquake off the coast of Japan near Sendai caused extensive equipment and infrastructure damage to Freescale’s facility. The ongoing safety concerns, damage to infrastructure and other basic services in the region, compounded by numerous major aftershocks, prohibit Freescale from returning the facility to an operational level required for wafer fab production in a reasonable timeframe. Freescalebelieves the best way to serve its customers is to focus efforts on accelerating the 200mm transition to alternate facilities.
When the earthquake struck off the coast of Sendai, the factory immediately ceased operations and all employees were safely evacuated. Freescale subsequently confirmed that all of its employees and contractors had survived the earthquake and resulting tsunami.
The company immediately commenced humanitarian efforts to assist its employees and their families. Freescale also began a preliminary assessment of the Sendai facility to determine the extent of the damage and how it might return to full or partial production in a safe and timely manner.
Freescale Semiconductor Inc.
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