Ericsson Uses STMicro

Ericsson signs strategic hardware manufacturing deal with STMicroelectronics for digital baseband ASICs

December 14, 2006

1 Min Read

STOCKHOLM -- With the growing volumes of WCDMA terminals, Ericsson Mobile Platforms has implemented a multiple supplier strategy for digital baseband ASICs. This will enable Ericsson Mobile Platforms to continue leveraging the latest technology, manufacturing capabilities, and supply capacity in the market.

Since the start of its operations, Ericsson Mobile Platform has had Texas Instrument (TI) as a strategic partner, and this relationship will continue. In addition, Ericsson Mobile Platforms have, in accordance with the new multiple supplier strategy, signed an agreement with a second strategic hardware manufacturing partner for digital baseband ASICs, STMicroelectronics (ST). Deliveries of new commercial platforms consisting of digital baseband ASICs manufactured by ST has already started.

Ericsson Mobile Platforms design digital baseband ASICs together with hardware manufacturing partners. With the multiple supplier strategy, Ericsson Mobile Platforms will continue to leverage its competence within cellular modem design and mobile terminal architecture across a broad supplier base. The hardware manufacturing partners bring competence in designing digital ASICs together with word class manufacturing capability in advanced technology nodes.

Robert Puskaric, head of Ericsson Mobile Platforms, says: "By using multiple hardware manufacturing partners, and their respective foundry partners, Ericsson Mobile Platforms is well prepared for the demands of increased volumes and complexity of the mobile terminal. This will allow us to bring an even more competitive offer to our customers and we are confident that this will help to further strengthen our leading position in WCDMA."

Ericsson AB (Nasdaq: ERIC)

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