eASIC Ships 3M

SANTA CLARA, Calif. -- eASIC Corporation, a provider of NEW ASIC devices, today announced that it has shipped in excess of three million chips and achieving this shipment milestone firmly solidifies eASIC’s position as a high volume supplier of custom integrated circuits. eASIC expects to be at more than double that number of shipments by the end of 2012.

“eASIC’s disruptive NEW ASIC devices are enabling OEMs and ASSP companies to get to market up to six months earlier than with traditional cell-based technology,” commented Jasbinder Bhoot, eASIC VP Marketing. “When our customers look at the overwhelmingly positive revenue impact of getting products into the market six months sooner, it’s a logical choice to choose eASIC NEW ASIC devices rather than use cell-based ASIC technology. With eASIC, designers benefit from a much simpler, much lower cost and significantly lower risk design flow than that of cell-based ASIC. Many typical ASIC tasks such as DFT insertion, clock tree synthesis and IR drop do not need to be performed. Placement and routing tools are also developed by eASIC. In addition, OEMs benefit from a much simpler manufacturing flow that only requires one single via mask for customizing the entire chip,” added Bhoot.

eASIC