Broadcom Demos at 4G World

Small cells and microwave highlight the Broadcom experience at 4G World

October 30, 2012

2 Min Read

CHICAGO -- Broadcom Corporation (BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced it will demonstrate its complete portfolio of end-to-end solutions for the mobile network at 4G World Chicago, including switch, small cell, processor and microwave solutions. The company will also unveil its new Digital Front End (DFE) development board with VersaLineTM DPD technology for faster wireless system deployments and significantly lower total cost of ownership. Visit www.broadcom.com to learn more.

Spanning the network -- from the access point to the edge, to the aggregation and the core -- Broadcom's high-bandwidth, end-to-end solutions support the mobile experience consumers crave with high quality voice connections, faster app downloads and uninterrupted video streaming. Broadcom's focus on the wireless infrastructure market is highlighted through the recent sampling of its 28 nanometer (nm) dual-core XLP-200 series communications processor, which provides an ideal solution for scalable small cell designs simultaneously supporting 3G, 4G and 5G WiFi. Volume shipments of 40nm XLP-300 series processors are ramping in wireless base station, radio network controller, mobile core and cloud applications.

The new BCM51030 DFE development board is designed to speed development of multi-protocol radio systems for macro and small cell base stations. The board ships with the components for a complete transmit loop, with the exception of the customer's selected driver and power amplifier (PA). Boards are now available with 1, 2 or 4 transmit channels and can support any protocol combination, any PA technology or architecture, and any frequency band with appropriate analog filter.

Broadcom's microwave system-on-a-chip (SoC) solutions enable mobile operators to manage the evolution of 4G/LTE networks and backhauling data from the cell sites to the core network. With unparalleled integration, the BCM85620 and BCM85810 SoCs combine the functionality of up to ten off-the-shelf application-specific standard parts (ASSPs) into a single chip, dramatically lowering power consumption and system cost.

Broadcom Corp. (Nasdaq: BRCM)

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