SUNNYVALE, Calif. -- Applied Micro Circuits Corp. (AMCC) (NASDAQ:AMCC - News) today announced the results of successful interoperability testing between the company's Circuit Emulation Services-over-Packet (CES) technology and Zarlink(TM) Semiconductor's ZL(TM) 5011x family of CES access solutions. The combination of the highest-density CES device on the market from AMCC and Zarlink's proven CES expertise will uniquely enable system vendors and carriers to build efficient, scalable (up to multiple OC-3 / OC-12) solutions for legacy T1/E1 and revenue-driven applications. The success of this collaboration is attributed to a focus on real-world network measurements and compliance with SAToP and G.8261 standards. As a result, AMCC and Zarlink are able to provide accurate technical results to customers for next-generation system designs.

"By combining our companies' CES technologies and leveraging AMCC's long-established networking expertise, we are providing our customers with the best solutions for all of their system design needs," said Peter Burke, senior vice president and general manager, Network Communications, Zarlink Semiconductor. "The demonstrated interoperability of our technologies gives customers the benefit of a complete converged end-to-end network solution while still using best-in-class components and technologies at each stage."

Applied Micro Circuits Corp. (Nasdaq: AMCC)