YORBA LINDA, Calif. and BERLIN -- QDI (Quantum Devices, Inc.) and its wholly owned subsidiary QDI Germany GmbH today announced development of a high power monolithic temperature tunable 1550 nm Indium Phosphide (InP) 8-element DFB laser array chip integrated with a combiner and a semiconductor laser amplifier (SLA). The wavelength selectable laser (WSL) chip is a DFB laser array chip with front facet CW optical output power of > 40 mW, a sidemode suppression ratio (SMSR) of > 40 dB and relative intensity noise (RIN) of <- 138 dB/Hz with a cumulative tuning range of 25 nm or 60 ITU wavelengths @ 50 GHz spacing.“Laser module packaging is 85% of the total cost. WSL’s integrated monolithic device design enables laser module packaging to be cost effective compared to MEMS controlled or multi-section DBR tunable lasers,” said Mo Mazed, president and CEO of QDI. Quantum Devices Inc. (QDI)